Global Fan Out Packaging Market (2021 to 2026) – Growth, Trends, COVID-19 Impact, and Forecasts – ResearchAndMarkets.com
DUBLIN–(BUSINESS WIRE)–The “Fan Out Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering.
The Fan-out Packaging market is expected to witness a CAGR of 18% during the forecasted period (2021 – 2026).
Companies Mentioned
- Taiwan Semiconductor Manufacturing Company Limited
- Jiangsu Changjiang Electronics Tech Co.
- Amkor Technology Inc.
- Advanced Semiconductor Engineering Inc
- Samsung Electro-Mechanics
- Powertech Technology Inc.
- Exhaustive List of Players in the Industry
Key Market Trends
Panel Level Packaging to Hold a Significant Share during the Forecast Period
- Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. FOPLP is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. Ability to develop advanced packing and testing services and secure customer relations serve as major factors.
- Smaller form factor with enhanced thermal performance has generated huge demand for panel level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others.
- Market trends of reduced cost of circuit packaging, enhanced design flexibility and physical performance, and increased investment on research & development activities are the factors for manufacturers to continue on this technology.
- Time to Market is a major consideration for PLP as most of the players in the market are still in their R&D phase for PLP, for instance, in September 2018, Powertech Technology Inc, is investing in panel-based fan-out technology and has a five-year TWD 50 billion (USD 1.6 billion) investment plan for the technology, began since 2017 and is expected to ramp up production by the later half of 2020.
Taiwan to Hold a Significant Share in the Market
- Taiwan houses some of the major semiconductor manufacturing companies which are fueling the demand for advanced semiconductor packaging especially in PLPs. According to the Semiconductor Industry Association (SIA), Asia-Pacific generates more than 50% revenue for global semiconductor sales, this in turn, is providing Taiwanese vendors with an opportunity to supply FOWLP for increased semiconductor applications.
- Most of the companies in the country are expanding their production capacity of Fan-out packaging which is further expected to increase the exports and will also help in developing local market.
- For instance, ASE Group brought up a FO-WLP line, in Kaohsiung, Taiwan, with other major OSATs in production or planning their launch phases for fan-out packaging. Also, Fab 3 in Hsinchu Science Park is expectd be the world’s first fab that would commercially use fan-out panel-level packaging (FOPLP) technology as it starts operations in the second half of 2020, according to Powertech Technology Inc.
- Also, the growing market for fifth generation (5G) wireless communication and high performance computing has enabled the manufacturers to come up with newer technologies. For instance, in High-Density Fan-out segment, TSMC as a sole leader, is planning to extend its FO-WLP segment into technologies like inFO-Antenna-in-Package (AiP) and inFO-on-Substrate (oS).
Key Topics Covered:
1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Fan-out Packaging Market Overview
4.2 Industry Attractiveness – Porter’s Five Force Analysis
4.2.1 Threat of New Entrants
4.2.2 Bargaining Power of Buyers/Consumers
4.2.3 Bargaining Power of Suppliers
4.2.4 Threat of Substitute Products
4.2.5 Intensity of Competitive Rivalry
4.3 Introduction to Market Dynamics
4.4 Market Influencers
4.5 Market Inhibitors
4.6 Opportunities for FOPLP
5 MARKET SEGMENTATION
5.1 By Market Type (USD Million)
5.1.1 Core Fan-Out
5.1.2 High-Density Fan-Out
5.2 By Carrier Type (USD Million)
5.2.1 200 mm
5.2.2 300 mm
5.2.3 Panel
5.3 By Business Model (USD Million)
5.3.1 OSAT
5.3.2 Foundary
5.3.3 IDM
5.4 Geography
5.4.1 Taiwan
5.4.2 China
5.4.3 United States
5.4.4 South Korea
5.4.5 Japan
5.4.6 Europe
6 FAN-OUT PACKAGING VENDOR Market SHARE ANALYSIS (BY ANNUAL WAFER CAPACITY – 2017, 2018)
7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 Taiwan Semiconductor Manufacturing Company Limited
7.1.2 Jiangsu Changjiang Electronics Tech Co.
7.1.3 Amkor Technology Inc.
7.1.4 Advanced Semiconductor Engineering Inc
7.1.5 Samsung Electro-Mechanics
7.1.6 Powertech Technology Inc.
7.1.7 Exhaustive List of Players in the Industry
8 MARKET OPPORTUNITIES AND FUTURE TRENDS
For more information about this report visit https://www.researchandmarkets.com/r/x3b543
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