Mitsubishi Electric to Ship Samples of 200Gbps PIN-PD Chip for Both 800Gbps and 1.6Tbps Optical-fiber Communication
Will increase speed and capacity of data-center communication
TOKYO–(BUSINESS WIRE)–
The upcoming introduction of the 200Gbps PIN-PD chip for optical reception follows Mitsubishi Electric’s launch of a mass-produced chip for optical transmission, the 200Gbps (112Gbaud four-level pulse-amplitude modulation [PAM4]) electro-absorption modulator laser diode (EML), in April this year. Leveraging the company’s well-established expertise in optical devices, the newly announced PD chip was developed by minimizing the photoelectric conversion area within a chip structure that integrates backside illumination and a convex lens.
Product Features
1) Backside illumination and convex lens integrated for high-speed, high-capacity communication in data centers
– The chip structure integrates backside illumination and a light-accumulating convex lens that minimizes the photoelectric conversion area, resulting in low capacitance to enable high-speed 200Gbps transmission (112Gbaud PAM4), twice that of conventional mainstream products (100Gbps).
For the full text, please visit: www.MitsubishiElectric.com/news/
Contacts
Customer Inquiries
Semiconductor & Device Marketing Div. B
Mitsubishi Electric Corporation
www.MitsubishiElectric.com/semiconductors/
Media Inquiries
Takeyoshi Komatsu
Public Relations Division
Mitsubishi Electric Corporation
Tel: +81-3-3218-2332
[email protected]
www.MitsubishiElectric.com/news/
