North America’s Advanced Packaging Market 2021-2031: Trend Forecasts, Growth Opportunities, Key & Emerging Player Profiles – ResearchAndMarkets.com
DUBLIN–(BUSINESS WIRE)–The “North America Advanced Packaging Market 2021-2031 by Product Type, End User, and Country: Trend Forecast and Growth Opportunity” report has been added to ResearchAndMarkets.com’s offering.
North America’s advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
Highlighted with 20 tables and 38 figures, this 89-page report is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year.
In-depth qualitative analyses include identification and investigation of the following aspects:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Fiver Forces
The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify North America advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Active Packaging
- Smart and Intelligent Packaging
Based on Packaging Platform, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Flip-Chip Ball Grid Array
- Flip Chip CSP
- Wafer Level CSP
- 2.5D/3D Integrated Circuit
- Fan Out Wafer Level Package (Fo-WLP)
- Embedded Die
- Fan In Wafer Level Package (Fi-WLP)
- Other Packaging Platforms
By End User, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Consumer Electronics
- IT and Telecom
- Automotive and Transportation
- Industrial Sector
- Healthcare and Life Science
- Aerospace and Defense
- Other End Users
Geographically, the following national/local markets are fully investigated:
- U.S.
- Canada
- Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players
- Advanced Semiconductor Engineering Inc.
- Amkor Technology, Inc.
- Brewer Science, Inc.
- Chipbond Technology Corporation
- Intel Corporation
- International Business Machines Corporation (IBM)
- Microchip Technology, Inc.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co. Ltd.
- STATS ChipPAC Pte. Ltd
- SUSS Microtec SE
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments, Inc.
- Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
For more information about this report visit https://www.researchandmarkets.com/r/o9fg1q
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